Micro SIDELED® – Flat side-emitting device ideal for compact assembly

Micro SIDELED® - Low height, side emitting LED

Designed to deliver exceptional quality and first-rate reliability, the Micro SIDELED® family from OSRAM Opto Semiconductors offers a choice of sidelookers for applications where space is at a premium. Available in three different heights, 0.6 mm, 0.8 mm and 1.0 mm, these LEDs combine high brightness with low power consumption and include silicone-encapsulated models for an extended product life.

Micro SIDELED®

  • More design-in flexibility due to availability of white Micro SIDELED® with different heights (1 mm and 0.6 mm)
  • Power saving due to low forward voltage and high efficiency
  • High ESD-withstand voltage and if needed, an additional ESD protection diode directly in the casting
  • Side-looking device
  • Flat package
  • High brightness
  • Optimized for coupling into light guides

The white Micro SIDELED® is available in four different heights with silicone encapsulation, which increases the product lifetime dramatically.

Micro SIDELED® 2808

  • Package: white SMT package, colored diffused silicone resin
  • Chip technology: InGaN on Sapphire
  • Typ. Radiation: 120° (Lambertian emitter)
  • Color: Cx = 0.30, Cy = 0.28 acc. to CIE 1931 (● white)
  • Optical efficacy: 45 lm/W
  • Corrosion Robustness Class: 1B
  • ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

Micro SIDELED® 3010

  • Package: white SMT package, colored diffused resin
  • Chip technology: InGaN
  • Typ. Radiation: 120° (horizontal), 120° (vertical)
  • Color: Cx = 0.33, Cy = 0.33 acc. to CIE 1931 (● white)
  • Corrosion Robustness Class: 3B
  • ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

Micro SIDELED® 3806

  • Package: white SMT package, colored diffused silicone resin
  • Chip technology: InGaN on Sapphire
  • Typ. Radiation: 120° (Lambertian emitter)
  • Color: Cx = 0.29, Cy = 0.275 acc. to CIE 1931 (● ultra white)
  • Optical efficacy: 155 lm/W
  • Corrosion Robustness Class: 1B
  • ESD: 1 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM)

Micro SIDELED® M 4518

To fulfill the needs for pachinko- and gaming applications, this product is especially designed to achieve easy white binning and to reach high ESD level.

  • Package: SMD package with silicone resin
  • Color: white, x = 0.245, y = 0.23 acc. to CIE 1931 (white)
  • Viewing angle at 50% IV: 120°
  • Chip technology: ThinGaN (true green, blue) / Thinfilm (red)
  • Soldering methods: reflow solderable
  • ESD-withstand voltage: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)

Micro SIDELED®

  • Signal and Symbol Luminaries
  • Indicators
  • Effect Light
  • White Goods
  • Pachinko

• Backlighting of phone displays and keypads

• Backlighting LCDs

• Optimized coupling into light guides